High Density Integration (HDI) Mini-Consortium

The CPES mini-consortium program provides a unique forum for creating synergy among industries and defining new research directions to meet future industry needs.  The formation of the mini-consortium allows CPES to pool resources and focus on developing pre-competitive technologies to address common challenges, and sharing the research results among mini-consortium members. 

Current HDI members (14)
ABB, ALSTOM Transport, Crane Aerospace, Delta Electronics, Dowa Metaltech Co., Ltd., GE Global Research, General Motors Company, Huawei Technologies, Nissan Motor Co., Ltd., Rolls-Royce, SAFRAN, Sumitomo Electric Industries, Ltd., TEMA, United Technologies Research Center

View HDI Prospectus (January 2013)

Over the past two decades, CPES has secured research funding from major industries, such as GE, Rolls-Royce, Boeing, Alstom, ABB, Toyota, Nissan, Raytheon, and MKS, as well as from government agencies including the NSF, DOE, DARPA, ONR, U.S. Army, and the U.S. Air Force, in research pursuing high-density system design. CPES has developed unique high-density and high-temperature packaging technologies applicable to such products as point-of-load converters, RF amplifiers, and wireless chargers.

In the HDI mini-consortium, the goal of high power density will be pursued following two coupled paths, both leveraging the availability of wide-bandgap power semiconductor, as well as high-temperature passive components and ancillary functions. The switching frequency will be pushed as high as component technologies, thermal management, and reliability permit. At the same time, the maximum component temperatures will be pushed as high as component technologies, thermal management, and reliability permit.

Proposed Work Scope: 

  • Integration Technologies
  • Components
  • Module-Level Integration
  • System-Level Integration