Integrated Power Electronics Module - a Building Block Concept for System Integration (Volume X)
- About the Book
- Table of Contents
- 10.1.01 : "PEBB and System Integration at Virginia Power Electronic Center"
- 10.1.02 : "Power Electronics Technology at the Dawn of the New Millennium - Status and Future"
- 10.1.03 : "Modeling, Control and Stability Analysis of a PEBB based DC DPS"
- 10.1.04 : "Investigation of Soft-Switching Techniques for Power Electronics Building Blocks (PEBB)"
- 10.1.05 : "Single Power Supply Based Transformerless IGBT/MOSFET Gate Driver with 100% High-Side Turn-on Duty Cycle Operation Performance Using Auxiliary Boostrapped Charge Pump"
- 10.1.06 : "Modularized Control Architecture for Power Converters"
- 10.1.07 : "The Design and Implementation of a New Integrated Gate Drive Board for Future Generation PEBBs"
- 10.1.08 : "Analysis of Converter Operation with Phase Legs in Daisy-Chained or Ring-Type Structure"
- 10.2.01 : "Thermal Management of High-Power Electronics Modules Packaged with Interconnected Parallel Plates"
- 10.2.02 : "Extraction of Parasitics within Wire-Bond IGBT Modules"
- 10.2.03 : "Packaging of Power Electronics Building Blocks Using Metal Posts Interconnected Parallel Plate Structure"
- 10.2.04 : "High Density Power Electronic Packaging"
- 10.2.05 : "Thermo-Mechanical Analysis of Metal-Post-Interconnected-Parallel-Plate Structure"
- 10.2.06 : "Thermal Management of Power Electronics Modules Packaged by a Stacked-Plate Technique"
- 10.2.07 : "An Innovative Technique for Packaging Power Electronics Building Blocks Using Metal Posts Interconnected Parallel Plate Structures"
- 10.2.08 : "Characterization of Interfacial Thermal Resistance for Packaging High-Power Electronics Modules"
- 10.2.09 : "A Thermo-Mechanical Study of Power Modules Using 3D Finite Element Modeling"
- 10.2.10 : "Characterization of Interfacial Thermal Resistance by Acoustic Micrography Imaging"
- 10.2.11 : "Multi-layer Integration Technology for Packaging of IPEM"
- 10.2.12 : "The Packaging of Integrated Power Electronics Modules Using Flip-Chip Technology"
- 10.3.01 : "An All-Fiber-Optic Interface for Microprocessor Control of Three-Phase Power Converters"
- 10.3.02 : "Multiple Sources in PEBB-Based DC Distributed Power Systems"
- 10.3.03 : "The Circulating Current in Paralleled Three-Phase Boost PFC Rectifiers"
- 10.3.04 : "Control of Circulating Current in Parallel Three-Phase Space-Vector Modulated PWM Boost Rectifiers"
- 10.3.05 : "Active Compensation of the Pulsating Current in a Distributed Power System"
- 10.3.06 : "Adjustable Speed Drive Neutral Voltage Shift and Grounding Issues in a DC Distributed System"
- 10.3.07 : "A Utility Power Supply for Nonlinear and Unbalanced Load in a PEBB Based DC Distribution Power System"
- 10.3.08 : "Individual Load Impedance Specification for a Stable DC Distributed Power System"
- 10.4.01 : "Novel Reduced-Order Small-Signal Model of Three-Phase PWM Rectifiers"
- 10.4.02 : "Small-Signal Modeling of Three-Phase PWM Modulator"
- 10.4.03 : "Comparison of High Frequency PWM Algorithms for Voltage Source Inverter"
- 10.4.04 : "A Three-Phase Inverter with a Neutral Leg with Space Vector Modulation"
- 10.4.05 : "Computer Modeling and Analysis of VSI Fed Permanent Magnet Synchronous Motor Drive Systems with Adjustable Levels of Complexity"
- 10.4.06 : "Analysis and Comparison of Space Vector Modulation Schemes for a Four-leg Voltage Source Inverter"
- 10.4.07 : "New High-Power, High-Performance Power Converter Sytems"
- 10.4.08 : "Analysis and Design of a Three-Phase Inverter with a Neutral Leg"
- 10.4.09 : "DSP-Based Implementation of a Power Electronic System"
- 10.4.10 : "Modeling and Control Design of Parallel Three Phase PWM Boost Rectifiers"
- 10.4.11 : "Multivariable Analysis and Control of the Three-Phase Boost Rectifier"
- 10.4.12 : "Control of the Synchronous Generator in Generator-Sets with Inverter Output"
- 10.4.13 : "Comparison of Common-Mode EMI for 3D SVM Schemes"
- 10.4.14 : "Four-legged Converter 3D SVM Scheme Over-Modulation Study"
- 10.4.15 : "A Novel Three-Phase Four-Leg Converter with Active Common-Mode Filter Function"
- 10.4.16 : "Input Filter Interaction in Three-Phase AC-DC Converters"
- 10.4.17 : "New Sensorless Control of Three-Phase Bi-Directional Converter Using Space Vector Modulation"
- 10.5.01 : "Multi-Level 2 Quadrant Boost Choppers for Superconducting Magnetic Energy Storage"
- 10.5.02 : "SVM of Three-Level VSI’s"
- 10.5.03 : "Evaluation and Development of New Power Electronic Technologies for Superconducting Magnetic Energy Storage (SMES) Using PEBB"
- 10.5.04 : "An Analysis of Midpoint Balance for the Neutral-Point-Clamped Three-Level VSI"
- 10.5.05 : "A Comprehensive Study of Neutral-Point Voltage Balancing Problem in Three-Level Neutral-Point- Clamped Voltage Source PWM Inverters"
- 10.5.06 : "New Cascade Switch Multi-Level PWM Converters"
- 10.5.07 : "Control Design and Implementation of Three-Level Two-Quadrant Chopper"
- 10.5.08 : "Control Design for Superconducting Magnetic Storage Power Conditioning System"
- 10.5.09 : "SMES Coil and the Power Electronics Interface"
- 10.5.10 : "An Investigation of the Dynamic Performance of a Static Synchronous Compensator with Superconducting Magnetic Energy Storage"
- 10.5.11 : "A Fast Space Vector Modulation Algorithm for Multilevel Three-Phase Converters"
- 10.5.12 : "Control Design of a Three-Level Voltage Source Inverter for SMES Power Conditioning System"
- 10.6.01 : "Characterization of Power Electronics System Interconnect Parasitics Using Time-Domain Reflectometry"
- 10.6.02 : "Accurate Modeling and Analysis of PWM Inverters for Electromagnetic Compatability Performance Evaluation"
- 10.6.03 : "EMI Experimental Comparison of PWM Inverters Between Hard-Switching and Soft-Switching Techniques"
- 10.6.04 : "Analysis of Conducted EMI Emissions from PWM Inverters Based on Empirical Models and Comparative Experiments"





