2003 Conference Proceedings

PLENARY SESSION

I.1: “Defining the Future for Microprocessor Power Delivery,” A. Lidow and G. Sheridan - International Rectifier Corporation

I.2 :“Three-Phase PWM Power Conversion - the Route to Ultra High Power Density and Efficiency,” J. W. Kolar, J. Miniböck and M. Baumann - Swiss Federal Institute of Technology (ETH) Zurich

I.3 “Alternative Energy: State of the Art and Implications on Power Electronics, ” V. Vlatkovic - General Electric Global Research Center

TECHNICAL SESSIONS

SESSION S1: VOLTAGE REGULATOR MODULES
S1.1 “Two-Stage Concept for Future 12V VRM,” Y. Ren, M. Xu and F. C. Lee - Virginia Tech

S1.2 “Microprocessor Power Management Integration by VRB-CPU Approach,” X. Zhang, A. Q. Huang, N. X. Sun and F. C. Lee - Virginia Tech

S1.3 “A Novel Soft-Switched, High-Frequency, High-Efficiency, High-Current 12V Voltage Regulator - the Phase-Shift Buck Converter,” J. Wei and F. C. Lee - Virginia Tech
SESSION S2: ELECTRO-THERMAL MODELING OF IPEMS
S2.1 “Integrated Multidisciplinary Modeling, Analysis and Design in Power Electronics,” D. Boroyevich and J. Z. Chen - Virginia Tech

S2.2 “Algorithm to Determine the Topology of a Thermal Equivalent Circuit from Simulation Data,” M. Bikdash, H. Rayadurgam, Y. Pang* and E. Scott* - North Carolina A&T State University; *Virginia Tech

S2.3 “Thermal Component Models for Electro Thermal Analysis of Multichip Power Modules,” J. J. Rodríguez, Z. Parrilla, M. Veléz-Reyes, A. Hefner*, D. Berning*, J. Reichl** and J. Lai** - University of Puerto Rico at Mayagüez; *National Institute of Standards and Technology; **Virginia Tech
SESSION S3: DISCRETE AND SMART POWER DEVICES AND ICS
S3.1 “Design and Fabrication of the Integrated DMOS-IGBT/MPS-Rectifier Power Device,” R. Natarajan and T. P. Chow - Rensselaer Polytechnic Institute

S3.2 “High Gain Monolithic 4H-SiC Darlington Transistors,” Y. Tang and T. P. Chow - Rensselaer Polytechnic Institute

S3.3 “Design and Processing of Si Lateral Trench Power MOSFETs,” K. R. Varadarajan and T. P. Chow - Rensselaer Polytechnic Institute
 
SESSION S4: DC/DC CONVERTERS
S4.1 “A Novel Current-Tripler DC/DC Converter,” J. Zhou, M. Xu and F. C. Lee - Virginia Tech

S4.2 “Novel Integrated Transformer Winding Scheme for Self-driven ZVS Interleaved Asymmetrical Half-Bridge for Telecommunications Quarter Brick,” D. Sterk, M. Xu, Y. Ren and F. C. Lee - Virginia Tech

S4.3 “General Concepts for High Efficiency High Frequency 48V DC/DC Converter,” M. Xu and F. C. Lee - Virginia Tech
 
SESSION S5: ELECTROMAGNETIC INTEGRATION OF IPEMS
S5.1 “Development of a Motor Drive Integrated Power Electronics Module,” S.-H. Park, E. R. Olson, J. J. Connors, T. M. Jahns, R. D. Lorenz, H. N. Shah*,Y. Xiao*, Z. Parrilla*, T. P. Chow*, E. J. Rymaszewski* and R. J. Gutmann* - University of Wisconsin - Madison; *Rensselaer Polytechnic Institute

S5.2 “Modeling and Measurements of Parasitic Parameters for Integrated Power Electronics Modules,” J. Z. Chen, L. Yang, D. Boroyevich and W. G. Odendaal - Virginia Tech

S5.3 “Planar Electromagnetic Integration Technologies for Integrated EMI Filters,” R. Chen, J. D. van Wyk, S. Wang and W. G. Odendaal - Virginia Tech
 
SESSION S6: IPEM INTEGRATED CURRENT AND TEMPERATURE SENSING AND CONTROL
S6.1 “Integrating Giant Magnetoresistive Current and Thermal Sensors in Power Electronic Modules,” E. R. Olson and R. D. Lorenz - University of Wisconsin – Madison

S6.2 “Active Thermal Tj and ?Tj Control and Thermal Modeling of Power Modules,” J. E. Ramos, J. J. Connors, D. A. Murdock and R. D. Lorenz - University of Wisconsin – Madison

S6.3 “An Evaluation of MI Sensors in Comparison with Current Sensor Technologies for Integratability,” C. Xiao, L. Zhao, T. Asada, J. D. van Wyk and W. G. Odendaal - Virginia Tech
 
SESSION S7: DISTRIBUTED POWER SYSTEMS
S7.1 “Integrated High Frequency DPS Front-end Converter,” W. Dong, B. Lu, B. Yang, Z. Lu, F. C. Lee, Y. Pang and E. Scott - Virginia Tech

S7.2 “High Frequency Investigation of Single-switch CCM Power Factor Correction Converter,” B. Lu, W. Dong, S. Wang and F. C. Lee - Virginia Tech

S7.3 “Small Signal Analysis for LLC Resonant Converter,” B. Yang and F. C. Lee - Virginia Tech

S7.4 “Effects of Parasitic Parameters on the Performance of EMI Filters,” S. Wang, F. C. Lee, D. Y. Chen and W. G. Odendaal - Virginia Tech
 
SESSION S8: INTEGRATED PACKAGING FOR CONVERTERS
S8.1 “Preliminary Electromagnetic Modeling of an Integrated RF-EMI Filter,” L. Zhao and J. D. van Wyk - Virginia Tech

S8.2 “High Density Integrated Electromagnetic Power Passives with Single Layer Symmetric Structure,” W. Liu, J. D. van Wyk and W. G. Odendaal - Virginia Tech

S8.3 “Evaluation of the Reliability of Interconnect Technologies for Power Semiconductor Devices,” J. N. Calata, J. G. Bai, G.-Q. Lu and C. Luechinger* - Virginia Tech; *Orthodyne Electronics

S8.4 “Modeling of Skin- and Proximity Effect Losses in Foils and in Planar Litz Windings,” S. Wang, M. A. de Rooij, W. G. Odendaal, J. D. van Wyk and D. Boroyevich - Virginia Tech
 
SESSION S9: MOTOR DRIVE INVERTER AND EMI ISSUES
S9.1 “Enhanced Phase-Leg Configuration with Shoot-Through Immunity,” S.-H. Park and T. M. Jahns - University of Wisconsin – Madison

S9.2 “Robust Voltage Commutation of Conventional Matrix Converter,” L. Wei, T. A. Lipo and H. Chan - University of Wisconsin – Madison

S9.3 “High Frequency Modeling of Induction Motor Drives for EMI and Overvoltage Mitigation Studies,” L. Arnedo and K. Venkatesan - University of Puerto Rico at Mayagüez

S9.4 “Conducted EMI Characterization of Inverter-Fed Drives,” W. Shen, Q. Liu, F. Wang, D. Boroyevich, V. Stefanovic* and M. Arpilliere** - Virginia Tech; *V-S Drives; **Schneider Toshiba Inverter Europe
 

DIALOGUE SESSIONS

Session I: Distributed Power Systems
D1.1 1MHz Self-Driven ZVS Full Bridge Converter for 48V Power Pods

D1.2 A Family of Buck-Type DC-DC Converters with Autotransformers

D1.3 Investigation of Synchronous MOSFET Body Diode Reverse Recovery Loss in Voltage Regulator Modules

D1.4 Applying Transformer Concept to Non-isolated Voltage Regulators Significantly Improves the Efficiency and Transient Response

D1.5 1MHz Multi-Resonant Push-Pull 48V VRM

D1.6 Quasi-Resonant, Active-Clamp, Tapped-Buck Converter for High-Frequency Voltage Regulator Applications

D1.7 A Novel Separated Source Driving Structure for High Frequency Voltage Regulator

D1.8 Non-linear Digital Controller Design for Voltage Regulator Module

D1.9 A-b-c Frame-Based AC-DC Conversion under Unbalanced AC Voltage Condition

D1.10 A High Power Density DC/DC Converter for High Power Distributed Power Systems

D1.11 Over Current Protection Methods for LLC Resonant Converter

D1.12 Investigation of Current Sharing in Front-end Distributed Power System with Input Current Sensing

D1.13 Dynamic Analysis of Outer Loop Current Sharing Control for Paralleled DC/DC Converters

D1.14 Integrated Electro-Thermal Design for PFC in DPS Systems with Improved Loss Models

D1.15 An Iterative Approach for Integrated Electro-Thermal Design of a Distributed Power Supply Systems Module

D1.16 EMI Filters Modeling and Scattering-Parameters Characterization

D1.17 Improving the Performance of Boost PFC EMI Filters

D1.18 Power Connector Parameter Analysis by 2D

D1.19 Study of Topology Candidates for Solid-State Lighting

D1.20 Digital Control of DC-DC Converter based on LQG/LTR Regulation and Sliding Mode Control

D1.21 Digital Control of Power Factor Correction

D1.22 Weight Optimization of Driving Amplifiers for Smart Actuators

D1.23 Simulation of Power Electronics Systems in Power Systems Studies

D1.24 Analysis and Implementation of a Fly-Back DC/DC Converter Operating in Continuous Conduction Mode
 
Session II: Motor Drives and Inverters
D2.1 Minimization of the DC Link Capacitor by a Rapid Control of the Instantaneous Active Power for PWM Rectifier under Unbalanced Operating Conditions

D2.2 Improvement for a High Performance Amplitude/Phase Modulated Digital-To-Synchro Switching Power Converter

D2.3 Torque Analysis and Cogging Torque Minimization in a Modular Permanent Magnet AC Machine with Concentrated Windings

D2.4 Investigation of Dual-bridge Matrix Converter Operation under Unbalanced Source Voltages

D2.5 Output Selection for Tuning of Field Oriented Controllers: Steady State Analysis

D2.6 Improved Gray-Box Modeling of Electric Drives using Neural Networks

D2.7 Comparison of Efficiencies of Three-Phase AC/AC Converter

D2.8 Sensorless Position Detection in a Permanent Magnet Generator

D2.9 Complicated Electric Machine System Modeling and Simulation utilizing MATLAB/SIMULINK S-function
 
Session III: Modeling and Control
D3.1 A Comparison of Power Electronics System Control Software Design Platforms: Dataflow Architecture and Mathworks Simulink + Real-Time Workshop Software Package

D3.2 Implementing Dataflow-based Control Software for Power Electronics Systems

D3.3 Digital Communication Network Design for Power Electronics Systems

D3.4 Evaluating the Performance Overhead of Object-Oriented Techniques in Embedded Software Design

D3.5 Transparent Distributed Messaging for Power Electronics Systems

D3.6 A Current Reconstruction Algorithm for Three-phase Inverters using Integrated Current Sensors in the Low-side Switches

D3.7 Using Compact Piezoelectric Transformers to Isolate Integrated Phase Leg Shunt Current Sensors

D3.8 Potential Application of Magneto-Optical Current Sensing in Power Modules

D3.9 Initial Rotor Position Estimation for an Integrated Starter Alternator IPM Synchronous Machine

D3.10 H-Infinity Control of a Three-Phase Boost Rectifier

D3.11 Performance Evaluation of an Integrated Bricks-&-Buses Architecture Realization of a Power Converter

Session IV: Packaging Techniques
 
D4.1 Power Cycling Tests for Passive Integrated Power Electronic Modules

D4.2 A Comparison of Lifetime and Thermal Performance of Lead-Free Solder Alloys for Bonding Power Devices in a Flux-less Re-flow Processes

D4.3 Calorimeter for Accurate Power Loss Measurement in IPEMs

D4.4 A Finite Element Modeling of Dynamic Hot Spot Effects in MOSFET Dies due to Voiding in the Solder Die-Attach

D4.5 Investigation of Gate-driver Selection based on Operating Conditions

D4.6 Pressure-assisted Low-temperature Sintering of Silver Paste as a Die-Attach Approach

D4.7 Planar Litz – a Method to Reduce High Frequency Conduction Losses in Integrated Components

D4.8 An Overview of Electromagnetic Modeling of Resonant Integrated Spiral Planar Power Passives (ISP3)

D4.9 An Experiment for Accurate Characterization of Transient and Steady-state Die Thermal Parameters

D4.10 Measurement and Calculation of Residual Stress Between Substrate and Copper Deposition in Integrated Passive Modules

D4.11 A Planar Process Module for Active IPEM Manufacturing
 
Session V: Semiconductor Devices and Power ICS
D5.1 A High-Frequency 1.5 MVA H-Bridge Building Block for Cascaded Multilevel Converters using Emitter Turn-Off Thyrister

D5.2 High Voltage 4H-SiC JBS Rectifiers Fabricated using an AlN Capped Anneal

D5.3 The Built-in Current Sensor and Over Current Protection of the Emitter Turn-off (ETO) Thyristor

D5.4 Overload Capability of the Emitter Turn-Off Thyristor (ETO) in STATCOM Applications

D5.5 Development of a 4800V, 300A, 10 kHz Scalable Power Semiconductor Switch (SPSS)

D5.6 High-Voltage Accumulation-Mode Lateral RESURF GaN MOSFETs on SiC Substrate

D5.7 A New Parameter Extraction for Advanced IGBT Model

D5.8 A Novel Model for MOSFET Switching Loss Calculation

D5.9 Analysis of dv/dt Induced Spurious Turn-on of MOSFET

D5.10 Study of Power Loss in DC-DC Converter using Finite Element Analysis
 
Session VI: Power Module Design Issues
D6.1 The Affects of Various Cooling Scenarios on a System of Integrated Circuits

D6.2 Thermal Characterization and Optimization of Active System IPEM

D6.3 Integrated Power Electronics Modules for 600V/10A Motor-Drive Applications using Flip-Chip Flex-Circuit Technology

D6.4 Active Gate Drive Development for the Gen II MD-IPEM

D6.5 Automation of Multidisciplinary IPEM Modeling, Design and Analysis

D6.6 Measurement-based Method to Characterize Parasitic Parameters of IPEM

D6.7 Thermo-Mechanical Analysis and Design Rules for Flexible Power Interconnects

D6.8 Simulating and Validating the Electro-thermal Behavior of Generation II IPEM

D6.9 Electro-Thermal Modeling of the IPEM Generation II in SABER

D6.10 Design Methodology for a Universal IPEM Switching Characteristics Tester

D6.11 Parasitics Extraction and Modeling for Active IPEMs

D6.12 Verifying Changes to STEP AP210 for IPEM Modeling

D6.13 A Computer-based System for Validation of Thermal Models for Multichip Power Modules