2002 Conference Proceedings
PLENARY SESSION
- P.1 : High-Power Applications of Power Electronics in Japan
- P.2 : Susceptibility of Integrated Circuits to RFI
- P.3 : Barriers and Opportunity for Power Train Integrated Power Electronics
TECHNICAL SESSIONS
- Session I: Converter Topologies
- S1.1 : A Novel Winding Coupled-Buck Converter for High-Frequency, High Step-Down DC/DC Conversion
- S1.2 : A High Efficiency Topology for 12V VRM - Push-Pull Buck and Its Integrated Magnetics Implementations
- S1.3 : Single-Stage Three-Phase AC-to-DC Front-End Converters for Distributed Power Systems
- Session II: Control and Sensor Techniques
- S2.1 : Developing Robust Algorithms for Speed and Parameter Estimation in Induction Machines
- S2.2 : Using On-Line Parameter Estimation to Improve Efficiency of IPM Machine Drives
- S2.3 : Design of Integrated Magnetoresistive Current Sensors for IPEMs
- Session III: Power Devices and Power ICS
- S3.1 : Robust High-Voltage Lateral RESURF MOSFETs in Silicon Carbide
- S3.2 : Design of a 4 MHz, 5V to 1V Monolithic Voltage Regulator Chip
- S3.3 : Design and Simulation of Integrated DMOS-IGBT/MPS-Rectifier Power Device
- Session IV: Power Module Design Issues
- S4.1 : Failure Minimizing, Active Thermal Control of IPEMs
- S4.2 : An Overview of the IPEM-Based Modular Implementation for Distributed Power Systems
- S4.3 : Electrical and Thermal Layout Design and Optimization Considerations for DPS Active IPEM
- Session V: Power Electronics Packaging
- S5.1 : A Failure Analysis Study of Semiconductor Power Device Construction
- S5.2 : Flip-Chip Flex-Circuit Packaging for 42V/16A Integrated Power Electronics Module Applications
- S5.3 : Evaluation of Interconnect Echnologies for Power Semiconductor Devices
- S5.4 : Experimental Investigation of Failure Mechanisms in Integrated Spiral Planar Power Passives
- Session VI: High Power Converters and Drives
- S6.1 : A Control Method in d-q Synchronous Frame for PWM Boost Rectifier under Generalized Unbalanced Operating Conditions
- S6.2 : Application of Synchronous and Stationary Frame Controllers for Unbalanced and Non-Linear Load Compensation in 4-Leg Inverters
- S6.3 : Matrix Converter Topologies With Reduced Number of Switches
- S6.4 : Model Reference Current Control of a Unipolar Induction Motor Drive
DIALOGUE SESSIONS
- Session I: Distributed Power Systems
- D1.1 : Control Bandwidth and Transient Response of Buck Converters
- D1.2 : Design Considerations for VRM Transient Response Based on the Output Impedance
- D1.3 : Optimum Design of the Active Droop Control Method for the Transient Response
- D1.4 : A Soft-Switched High Efficiency Fast Transient Response 12V VRM-Phase-Shift Buck
- D1.5 : Investigation of Topology Candidates for 48V VRM
- D1.6 : A Novel Simple and High Efficiency DC/DC Transformer
- D1.7 : Comparison about Five Candidates for 12V VRM Topology
- D1.8 : Integrated Magnetic for LLC Resonant Converter
- D1.9 : High Power Density Electronic Ballast for HID Lamps
- D1.10 : Inductor-Less Charge Pump PFC Electronic Ballast
- D1.11 : Study of Digital vs. Analog Control
- D1.12 : Performance Evaluation of CoolMOSTM and SiC Diode for PFC Applications
- D1.13 : A PFC Boost Converter with Lossless Snubber under Minimum Voltage Stress
- D1.14 : A High-frequency Switching Power Amplifier for A Deformable Mirror System
- D1.15 : Design of Piezoelectric Transformer for PFC Electronic Ballast
- D1.16 : A Novel Thermally Conductive Mounting Technique for Piezoelectric Transformer
- D1.17 : Characterization of Nonlinear Internal Resistance of a Power Piezoelectric Transformer
- D1.18 : A Primary-Side-Assisted Zero-Voltage and Zero-Current Switching Three-Level DC-DC Converter with Phase-Shift Control
- D1.19 : Single Layer Iron Powder Core Inductor Model Study
- D1.20 : Parasitic Ringing and Design Issues of High Power Interleaved Boost Converters
- D1.21 : Design Considerations for a 48 V Fuel Cell to Split Single Phase Inverter System with Ultracapacitor Energy Storage
- D1.22 : Impact of Renewable Energy Sources
- D1.23 : A Self-Boost Charge Pump Topology for a Gate Drive High-Side Power Supply
- Session II: Motor/Drives and Inverters
- D2.1 : Low-cost Current Source Drive System
- D2.2 : New Feed-Forward Space-Vector PWM Method to Obtain Balanced AC Output Voltages in a Three-Level Neutral-Point-Clamped Converter
- D2.3 : Limits of the Neutral-Point Balance in Back-to-Back-Connected Three-Level Converters
- D2.4 : High Frequency Induction Motor Model For EMI and Over-Voltage Studies
- D2.5 : Conducted EMI and Over-voltage Investigation in a PWM Inverter Fed Induction Motor Drives
- D2.6 : A Cost Effective Three-Level MOSFET Inverter for Low Power Drives
- D2.7 : Active harmonic cancellation using synchronous discrete-time feedback compensation
- D2.8 : Electric Disturbances Produced by the Static Frequency Converter of a Pumped Storage Station
- D2.9 : Current Reconstruction using Integrated Current Sensors in Three-Phase Motor Drives
- Session III: Modeling and Control
- D3.1 : Applying Object-Oriented Techniques in Embedded Software Design
- D3.2 : Processing and Characterization of Magneto-optic Rare Earth Substituted Yttrium Iron Oxide
- D3.3 : Design Considerations for a 1MHz MOSFET Gate-driver for Integrated Converters
- D3.4 : Comparison of Digital Control Techniques for Low Cost UPS Applications
- D3.5 : DARK: Designing A High Performance Micro-kernel for Power Electronics Controllers
- D3.6 : Average Modeling of a Hexagon Transformer and Rectifier
- D3.7 : Analyzing Methods Study of Outer Loop Current Sharing Control for Paralleled DC/DC Converters
- D3.8 : Gray-Box Modeling of Electric Drive Systems using Neural Networks
- D3.9 : Developing Novel Three-phase SPWM Control Algorithms for Digital-to-Synchro Converter Application
- D3.10 : Protocol Design of Dual Ring PESNet (DRPESNet)
- D3.11 : Designing Reusable, Reconfigurable Control Software for Power Electronics Systems
- D3.12 : Design of Integrated Shunt Current Sensors for IPEMs
- Session IV: Packaging Techniques
- D4.1 : Improved Loss Determination for Planar Integrated Power Passive Modules
- D4.2 : Flip-chip on Flex Power Modules for Automotive Application
- D4.3 : A Generalized Two Conductor Model for Integrated Passives Components
- D4.4 : Finite-Element Thermal Modeling for LC Integrated Passive Module
- D4.5 : Integrated RF-EMI transmission line filters for Integrated Power Electronics Modules
- D4.6 : Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow
- D4.7 : Second Order Approximation Lumped Parameter Model for Planar Integrated L-L-C-T Module
- D4.8 : Fast Power-Cycling Test of Area-Array Interconnected Power Devices
- Session V: Semiconductor Devices and Power ICS
- D5.1 : Monolithic Integration of A Boost DC-DC Converter
- D5.2 : Experimental Performance of Integrated DMOSFET/MPS Rectifier
- D5.3 : Active Gate Control for Parallel Operation of IGBT Devices
- D5.4 : Cryogenic Operation of 4H-SiC Schottky Rectifiers
- D5.5 : Hybrid All-SiC MOS-Gated Bipolar Transistor (MGT)
- D5.6 : Electrical Characterization of Phosphorous Doped n-type SiC Epitaxial Layers
- D5.7 : Vapor Phase Epitaxial Growth of n-type SiC Using Phosphine as the Precursor
- D5.8 : The Uniform Turn-on of the Emitter Turn-Off Thyristor
- D5.9 : The Emitter Turn-Off Thyristor-Based DC Circuit Breaker
- D5.10 : Parallel Operation of the Emitter Turn-Off (ETO) Thyristor
- D5.11 : Comparison of High Power IGBT, IGCT and ETO for Pulse Applications
- D5.12 : A Novel CMOS Power IC Process for Monolithic Integration of 12-V Input VRM
- D5.13 : The New Generation Emitter Turn-Off Thyristor
- D5.14 : Low Voltage Si Lateral Trench RESURF MOSFETs
- D5.15 : High -Voltage Trench Sidewall Oxide-Merged PiN/Schottky (TSOX-MPS) Rectifiers
- Session VI: Power Module Design Issues
- D6.1 : Reduced Electro-thermal for a Typical IPEM: Part I- Thermal Analysis
- D6.2 : General Guidelines for Thermal Management of High-Power Components Relative to a DC/DC Converter
- D6.3 : Software Integration for IPEM Design, Modeling, and Analysis
- D6.4 : A Lumped Parameter Thermal Model for Electro-Thermal Analysis of Integrated Power Electronic Modules
- D6.5 : Design and Analysis of An Apparatus for Loss Measurement of Integrated Power Electronics Modules
- D6.6 : Double-Sided IPEM Cooling Using Miniature Heat Pipes





