2001 Conference Proceedings

PLENARY SESSION

P.1 : Automotive Electrical Systems-The Power Electronics Market of the Future
P.2 : Electromagnetic Integration, the Next Frontier in Packaging
P.3 : Power Electronics: Will Our Current Technical Vision Take Us to the Next Level of AC Drive Product Performance

TECHNICAL SESSIONS

Session I: Motor Drives
S1.1 : Critical Inductance in Voltage Regulator Modules
S1.2 : The Active-Clamp Coupled-Buck Converter for 12V Input Voltage Regulator Modules
S1.3 : LLC Resonant Converter for Front End DC/DC Conversion
Session II: Motor Drives and Inverters
S2.1 : Comparative Evaluation of Soft-Switching Inverter Techniques for Electric Vehicle Drive Applications
S2.2 : Flexible dv/dt and di/dt Control Method for Insulated Gate Power Switches
S2.3 : Design Considerations for Single Phase Induction Motor Packaged Drives
Session III: Integrated Packaging
S3.1 : Dimple-Array Interconnect Technique for Interconnecting Power Devices and Power Modules
S3.2 : Thermal Impedance Measurement in Power Semiconductor Modules
S3.3 : Embedded Power Technology for IPEMs Packaging Applications
Session IV: Converter Design Techniques
S4.1 : Passive Cancellation of Common-Mode Noise in Power Electronic Circuits
S4.2 : Design of a Boost Power Factor Correction Converter Using Genetic Algorithms
S4.3 : Radial Mode Piezoelectric Transformer Design for Fluorescent Lamp Ballast Applications
Session V: Semiconductor Devices and Power ICS
S5.1 : Epitaxial Growth of Thick (~30m) 4H-SiC on 4H-SiC Substrates for Power Device Applications
S5.2 : Processing, Characterization and Analysis of High-Voltage Trench Sidewall Oxide-Merged PiN/Schottky (TSOX-MPS) Rectifiers
S5.3 : Abnormal Failure Mechanism of Asymmetrical Emitter Turn-Off Thyristor in Converter Applications
Session VI: Modeling and Control
S6.1 : Intelligent, Failure Minimizing IPEM Control
S6.2 : Comparison of Parameter Conditioning in Output Error and Equation Error Approaches in Speed and Parameter Estimation in Induction Machines
S6.3 : Integrated Electrical and Thermal Anaysis of Integrated Power Electronics Modules Using iSIGHT

DIALOGUE SESSIONS

Session I: Distributed Power Systems
D1.1 : Development of Digitally Controlled Automotive HID Ballast System
D1.2 : A Fixed-Frequency Zero-Voltage-Switching Three-Level DC/DC Resonant Converter
D1.3 : Ripple Reduction for High Power Fuel Cell Converter Applications
D1.4 : Power Balance Control and Voltage Conditioning for Fuel Cell Converter With Multiple Sources
D1.5 : Low Q Characteristic of Series Resonant Converter and Its Application
D1.6 : Passive Current Shaping for Series Resonant Converter
D1.7 : Analysis and Solutions of the Interaction Problems Between Transfo rmer Primary Snubbers and Saturable Reactors in a Magamp Switching Power Supply
D1.8 : Snubbers and Saturable Reactors in a Magamp Switching Power Supply
D1.9 : A Comparison Study of High Step-up DC/DC Converters
D1.10 : Evaluation of the Two-Switch Three-Level Boost Rectifier
D1.11 : Three phase Quasi Single-Stage AC/DC Converter
D1.12 : Optimum Harmonic Reduction with a Wide Range of Modulation Indexes for Multilevel Converters
D1.13 : Unity Power Factor Control of a Three-pole PWM AC/DC Converter under Single-phase Input
D1.14 : Study and Design of a Voltage-Source Single-Stage PFC Converter
D1.15 : Magnetic Component Comparison between the Continuous-Conduction-Mode and Critical-Mode Boost PFC Converters for Distributed-Power-System
D1.16 : Single-Switch Parallel Power Factor Correction AC/DC Converters
D1.17 : Comparison of Three Topology Candidates for 12V VRM
D1.18 : Static and Dynamic Modeling of the Active Clamp Coupled-Buck Converter
D1.19 : The Integrated-Filter Push-Pull Forward Converter for 48V Input Voltage Regulator Modules
D1.20 : A Lossless Clamp Circuit for Tapped-Inductor Buck Converters
D1.21 : Study of Three Topology Candidates for 48V VRM
Session II: Motor/Drives and Inverters
D2.1 : A Novel ZVT Inverter with Simplified Auxiliary Circuit
D2.2 : Maximum Pulse Width Space Vector Modulation for Soft-switc hing Inverters
D2.3 : Low-Cost IPEM-Based Motor Drives for Automotive Accessory Applications
D2.4 : Minimization of Reverse Recovery Effects in Hard-Switched Inverters using CoolMOS™ Power Switches
D2.5 : Adaptive Parameter Estimation for IPM Machine Drives
D2.6 : Design of a 50-kW Three-Phase Zero-Current-Transition Inverter with Three Auxiliary Switches for Electric Propulsion Drives
D2.7 : Low-cost Current Source Drive System
D2.8 : Pspice Modeling of Adjustable Speed Drives with Feeders
D2.9 : Modeling and Control of Switc hed Reluctance Motor Drive Using Average-Current Mode Controller
D2.10 : Model Reference Current Control of a Unipolar Induction Motor Drive
D2.11 : High Frequency Operation of a Megawatt Voltage Source Inverter Equipped with ETOs
D2.12 : A Novel Load Adaptive Zero Voltage Switching Utilizing Diode Reverse Recovery Current for Soft-Switching Choppers and Inverters
Session III: Modeling and Control
D3.1 : Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens
D3.2 : A Comparative Evaluation of Current-Sharing Methods for Paralleled Power Modules
D3.3 : Loss Evaluation of Different Continuous-Conduction-Mode Boost PFC Topologies with Simulation Tool
D3.4 : Stability Margin Monitoring for DC Distributed Power Systems Via Current/Voltage Perturbation
D3.5 : An Experimental Current Sharing Design and Implementation
D3.6 : Gray-Box Modeling of Electric Drive Systems Using Neural Networks
D3.7 : PSpice Modeling of an Induction Motor Drive System
D3.8 : Improving Accuracy of Current Shunts via Multi-Disciplinary Models
D3.9 : Applicability of Using A Fuzzy Controller for DC-DC Converters
Session IV: Packaging
D4.1 : Influence of Design Parameters on the Efficiency of Heat Sinks for Power Electronics Modules
D4.2 : Three-dimensional Integrated Circuit Technology: Research Trends and Power Electronics Opportunities
D4.3 : Interconnect of Power Modules Using Laminated Polymer Overlay
D4.4 : Integrated Thin Film Capacitors
D4.5 : D(2)BGA Chip-Scale IGBT Package
D4.6 : Multi-level Modeling and Simulation of Power Electronic Systems
D4.7 : Feasibility of Heat Pipes for Double-Sided Cooling of Integrated Power Electronic Modules
D4.8 : Integration of a 1-MHz Converter with Active and Passive Stages
D4.9 : Flip-Chip Flex-Circuit Packaging for Power Electronics
D4.10 : An Alternative Planar Multi-cell Structure for Integrated Reactive Components
Session V: Semiconductor Devices
D5.1 : High-Voltage Lateral RESURF MOSFETs in 4H Silicon Carbide
D5.2 : Inversion and Accumulation-Layer Electron Mobility in 4H-SiC MOSFETs
D5.3 : RBSOA and Thermal Stability Study of Large Area Silicon Power Diode
D5.4 : Characterization of MOS Capacitors on n-type Gallium Nitride
D5.5 : Design and Fabrication of Integrated DMOSFET/MPS Rectifier
D5.6 : Reliability Testing of SiC High-Voltage Power Devices
D5.7 : The Effect of Emitter Implant on High-Voltage 4H-SiC BJTs
D5.8 : Hybrid MOS-Gated Bipolar Transistor Using High-Voltage 4H-SiC BJT
D5.9 : Analysis and Comparison of Si Lateral Trench RESURF MOSFETs
D5.10 : In-situ Etching of SiC Prior to Epitaxial Growth Using H(2)O(2) Gas Mixtures
D5.11 : Characterization of IGCT Under Zero-Current-Transition Condition
D5.12 : Simulations of 1200V 4H-SiC Trench Sidewall Oxide-Junction Barrier Schottky Rectifiers
D5.13 : Performance Analysis of a Novel Dual-gate IGBT
D5.14 : Electrical Characteristics of High-Voltage GTO Thyristors in 4H-SiC
Session VI: IPEM Synthesis and EMI
D6.1 : Survey of EMI Reduction Techniques in Switched-mode Power Supplies
D6.2 : Design And Implementation of a Fuzzy Controller For Thermally Comfortable HVAC Application
D6.3 : Describing Power Electronics Systems using STEP AP210
D6.4 : Design of a Universal Controller for Distributed Control and Power Electronics Applications
D6.5 : Improved Architecture of PEBB Plug and Play Power Electronics Systems: Elementary Control Object (ECO) and Dataflow
D6.6 : Analysis of the Trade-offs between Thermal Behavior and EMI Noise Levels in a Boost PFC Circuit
D6.7 : Development of Cost Models for Power Electronics Assemblies
D6.8 : Energy-Based Modular Decomposition of Multidisciplinary IPEM models