Achievements Showcase

Click here to view CPES Highlights (PDF, 19MB)

Click the links below to view CPES Achievements in Research, Education and Industry Collaboration.

Research

Dynamometer Facility UW-Madison Develops High-Performance Dynamometer Test Facilities (2007)
3D Integration Three-Dimensional Integration of Power Supply Module (2007)
Multi-functional IPEMs Multi-functional field sensing in IPEMs (2007)
Hybrid Testbed Hybrid Autonomous Electric Power System Testbed (2007)
High-Voltage Reverse Blocking High-Voltage Reverse Blocking Integrated GaN MOSFET/Schottky Rectifier (2007)
FlexPower FlexPower - Flexible Interconnect Technology for Power Packaging (2007)
CPES Legacy CPES Legacy: Integrated System Approach Transforms the Power Electronics Discipline (2007)
Black-box Model Black-box Modular-Terminal-Behavioral Modeling of Power Electronics Converters (2007)
CPES Outreach Workshop CPES Outreach Workshop Brings Together Power Electronics Experts from Around the World (2006)
EMI Containment Electromagnetic Noise Containment with Integrated Planar Power Connection (2006)
Integrated Current Sensing Inexpensive, compact, high performance integrated current sensing (2006)
Active SC-IPEM Active Standard Cell Integrated Power Electronics Module (SC-IPEM) (2006)
Inversion-type GaN MOSFETs World's Best Enhancement Mode, Inversion-Type GaN MOSFETs (2006)
High-temperature packaging Reliable Conductor-Semiconductor Interface for High-Temperature Packaging (2006)
Electro-thermal behavior modeling Medium-Sized Equivalent Circuits for Efficient Modeling of Electro-Thermal Behavior (2006)
Thermal Component Network Model Thermal Component Network Model for High Power IGBT Developed in Joint Collaboration Between NIST and UPRM-CPES (2006)
A New Tool for Reliability Analysis A New Tool for Reliability Analysis of Designs for Next-Generation Power Electronics Packages (2006)
EMI Filter IPEM A New Class of EMI Filter IPEMs (2005)
Integrated Double-Sided Cooling Integrated Double-Sided Cooling (2005)
Integrated Modular Motor Drive Integrated Modular Motor Drive (IMMD) (2005)
Nanoscale Die-Attach Technology Nanoscale Die-Attach Technology for High-Temperature Packaging of Power Devices (2004)
Multidisciplinary Software Integration Multidisciplinary Software Integration - Tools for Power Electronics (2004)
Augmented Phase-leg Conversion Augmented Phase-leg Configuration (2004)
A New Way of Powering IT A New Way of Powering Information Technology (2004)
A New Power Management Solution A New Power Management Solution for Intel Microprocessors (2003)
High-Frequency Brick Type DC/DC Converters High-Frequency Brick Type DC/DC Converters (2003)
Power Management Architecture for Laptop Computers A New Power Management Architecture for Laptop Computers (2003)

Industry Collaboration

CPES IAB Workshop: "From Success to Significance" (2006)
Mini-Consortium for Focused Research - Creating Synergy, Maximizing Technology Transfer Impact (2005)
Industry-Student Forum - An Effective Means of Bridge-Building (2005)
Promoting Easy Intellectual Property Access via the CPES Intellectual Property Protection Fund (IPPF) (2004)

Facilities

CPES-VT Upgrades Lab to have Medium Voltage, Megawatts Power Capability (2006)

Education

Worldwide Impact on Power Electronics Education (2007)
CPES Integrated Packaging Lab (2007)
Duke Energy Day (2006)
CPES Student Leadership Council Hosts NSF ERC Student Retreat (2005)
CD-ROM Tutorial for Elementary School Students Under Development (2005)
CPES Develops REU for Louis Stokes Alliance for Minority Participation (LS-AMP) Scholars (2005)
E-Wheels Program Introduces Undergraduates to Power Electronics (2004)
Mentorship for Students in Rural Southwestern Virginia (2004)
RPI Offers Power Device Certificate Program for Industrial Engineers (2003)
Research Experiences for Undergraduates (2002-2004)
A Robotics Challenge Program for Southwestern Virginia (2003)