Fundamental Knowledge Thrust: Integratable Materials (IM)
Leader: Guo-Quan Lu, Virginia Tech
The goal of the IM thrust is to conduct long-term, high-risk materials
research aimed at addressing the needs of four technological areas
that are critical to integration of power electronics systems:
thermal management; passive integration using multi-functional
materials; electromagnetic fields sensing; and understanding physical
failure mechanisms. The general technical approach is to explore
synthesis, processing, and integration of nanoscale materials that
have novel chemical, thermal, and electromagnetic properties. Since
its establishment three years ago, the IM thrust has made significant
progress in understanding physical mechanisms governing the processing
of nanoscale particles and their applications for integration in
power electronics systems. Major achievements resulted include:
(1) a novel nanoscale metal pastes sintered at low temperature
for attaching semiconductor devices – The sintered attachment
offers superior electrical, thermal, and thermo-mechanical properties
(Fig. 5). The new die-attach solution can also support devices
capable of operating at junction temperatures over 500oC. The technology
has been successfully transferred to a start-up company for electronic
packaging of microelectronics, power electronics, and optoelectronics
devices; (2) synthesis of a multi-ferroic nano-composite for making
passive elements; the material system may be used as a platform
for integrating passive elements; and (3) fundamental knowledge
gained on competing physical processes between coagulation and
coalescence aggregation of nano-particles, and its successful application
in formulating nanoscale metal pastes for die attachment.
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A lead-free die-attach solution using low-temperature sintering
of nanoscale metal paste for high-performance and high-temperature
interconnection of semiconductor devices. |