Enabling Technologies Thrust: Electro-Magneto-Thermo-Mechanical Integration Technology (EMTMIT)
Leader: Thomas Jahns, University of Wisconsin-Madison
The EMTMIT thrust focuses on two aspects of the IPEM. One is the
development of integrated modules as a “standard-cell” IPEM
and the other is the development of application-specific power
electronics integration with loads such as motors and microprocessors.
Using mainly the integration technologies from CPES fundamental
knowledge thrusts, two basic types of standard IPEMs have been
developed in EMTMIT thrust: 1) Active IPEM, which functions as
a voltage source single-pole double-throw switch (i.e., a totem-pole
half-bridge), integrates two active semiconductor switches, associated
diodes, together with gate driver, sensor, protection, and heat
transfer structure within the module; 2) Passive IPEM, consisting
of integration of energy storage capacitors, inductors, and transformers.
Standard-Cell IPEM (SC-IPEM)
The goal is to develop IPEM technology intended for standard configurations
appropriate for use in a wide range of potential applications.
Attention is directed towards carrying out proof-of-concept demonstrations
that explore the compatibility of new CPES technologies for achieving
high performance combined with rugged self-protection features
and low cost. The figure below shows a prototype IGBT-based active
IPEM using CPES non-wirebond Embedded Power packaging technology.
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CPES IGBT active IPEM |
Integrated Modular Motor Drive (IMMD)
The goal is to achieve significant manufacturability and reliability
advantages by developing the integrated motor drive as a modular
assembly. A promising approach for achieving this objective is
to break the machine stator into individual segmented stator poles
with concentrated windings. The figure below illustrates the conceptual
CPES IMMD that integrates power electronics and controller directly
into the motor housing. Rather than simply placing the converter
physically close to the motor as done in some commercial products,
the IMMD integration is based on a modular configuration – one
converter phase-leg per motor pole.
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CPES integrated modular motor drive |
Integrated Power Supplies (IPS)
The goal is to develop the technology needed to achieve a complete
physical integration of high-performance power supplies in a three-dimensional
multi-chip module. One application example is the integration of
such a power supplies with microprocessors to obtain the most efficient
power management solution. According to the Intel roadmap, the
future generations of microprocessors by 2010 will be well beyond
the capabilities of voltage regulator module (VRM) technologies
known today, thus a dramatically different approach is required.
The figure below shows a CPES 3-D IPS module aimed at achieving
physical integration of all active and passive components in a
3-dimensional
package. The IPS has a multi-coupled cell infrastrcuture with multi-stage
multi-MHz multi-phase voltage regulator module (VRM); LTCC resonant
converter processing technology for inductors and capacitors; and
innovative packaging concepts to enable a System-in-Package (SIP)
power module.
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CPES 3-D integrated power supply converter module |