Enabling Technologies Thrust: Electro-Magneto-Thermo-Mechanical Integration Technology (EMTMIT)
Leader: Thomas Jahns, University of Wisconsin-Madison
The EMTMIT thrust focuses on two aspects of the IPEM. One is the development of integrated modules as a “standard-cell” IPEM and the other is the development of application-specific power electronics integration with loads such as motors and microprocessors. Using mainly the integration technologies from CPES fundamental knowledge thrusts, two basic types of standard IPEMs have been developed in EMTMIT thrust: 1) Active IPEM, which functions as a voltage source single-pole double-throw switch (i.e., a totem-pole half-bridge), integrates two active semiconductor switches, associated diodes, together with gate driver, sensor, protection, and heat transfer structure within the module; 2) Passive IPEM, consisting of integration of energy storage capacitors, inductors, and transformers. Standard-Cell IPEM (SC-IPEM) The goal is to develop IPEM technology intended for standard configurations appropriate for use in a wide range of potential applications. Attention is directed towards carrying out proof-of-concept demonstrations that explore the compatibility of new CPES technologies for achieving high performance combined with rugged self-protection features and low cost. The figure below shows a prototype IGBT-based active IPEM using CPES non-wirebond Embedded Power packaging technology.
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| CPES IGBT active IPEM |
Integrated Modular Motor Drive (IMMD) The goal is to achieve significant manufacturability and reliability advantages by developing the integrated motor drive as a modular assembly. A promising approach for achieving this objective is to break the machine stator into individual segmented stator poles with concentrated windings. The figure below illustrates the conceptual CPES IMMD that integrates power electronics and controller directly into the motor housing. Rather than simply placing the converter physically close to the motor as done in some commercial products, the IMMD integration is based on a modular configuration – one converter phase-leg per motor pole.
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| CPES integrated modular motor drive |
Integrated Power Supplies (IPS) The goal is to develop the technology needed to achieve a complete physical integration of high-performance power supplies in a three-dimensional multi-chip module. One application example is the integration of such a power supplies with microprocessors to obtain the most efficient power management solution. According to the Intel roadmap, the future generations of microprocessors by 2010 will be well beyond the capabilities of voltage regulator module (VRM) technologies known today, thus a dramatically different approach is required. The figure below shows a CPES 3-D IPS module aimed at achieving physical integration of all active and passive components in a 3-dimensional package. The IPS has a multi-coupled cell infrastrcuture with multi-stage multi-MHz multi-phase voltage regulator module (VRM); LTCC resonant converter processing technology for inductors and capacitors; and innovative packaging concepts to enable a System-in-Package (SIP) power module.
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| CPES 3-D integrated power supply converter module |