 |  | |
CPES Patent on 3D Integration of Embedded Power Module
This patent application has been sponsored by CPES IPPF (Intellectual Property Protection Fund) - a unique IP access mechanism that provides extraordinary IP advantage to CPES Principal Plus and Principal Members.
|
||
 |
 |
Patent Abstract: A modified planar Low Temperature Co-Fired Ceramic (LTCC) high conductance inductor, embedding a large cross section conductor, supports a stacked arrangement of heat spreader, inductor and active device layers. Interlayer electrical connections connect the layers. Optionally, a DC-DC converter includes the modified planar LTCC high conductance inductor, embedding a large cross section conductor, supporting a stacked arrangement of heat spreader, capacitor and active device layers, the active devices layer including the switching transistors. The active devices layer may include semiconductor dies embedded in a substrate.