CPES

CPES Patent on 3D Integration of Embedded Power Module


Method and Apparatus for Three-Dimensional Integration of Embedded Power Module
by Michele H. Lim, Zhenxian Liang, J. Daan van Wyk
U.S. Patent: 7,932,800 
Issued:  April 26, 2011

Patent Abstract:  A modified planar Low Temperature Co-Fired Ceramic (LTCC) high conductance inductor, embedding a large cross section conductor, supports a stacked arrangement of heat spreader, inductor and active device layers. Interlayer electrical connections connect the layers. Optionally, a DC-DC converter includes the modified planar LTCC high conductance inductor, embedding a large cross section conductor, supporting a stacked arrangement of heat spreader, capacitor and active device layers, the active devices layer including the switching transistors. The active devices layer may include semiconductor dies embedded in a substrate.
 

This patent application has been sponsored by CPES IPPF (Intellectual Property Protection Fund) - a unique IP access mechanism that provides extraordinary IP advantage to CPES Principal Plus and Principal Members. 
 

 

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