Congratulating CPES graduate - Thomas Lei

Thomas G. Lei completed his Ph.D. program in April 2010. His defense presentation and dissertation, "Thermo-Mechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging” are available online to CPES Principal Plus, Principal and Associate members via password access.

Thomas received his B.S. degree in biomedical engineering in 2003 from Zhejiang University, China, and his M.S. and Ph.D. degrees in materials science and engineering from the Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, in 2008 and 2010, respectively. He joined the Center for Power Electronics Systems (CPES) in 2003, working on materials research for high-temperature electronics packaging.

Thomas has published 15 papers in journals and conference proceedings and has one US patent. His research interests include the synthesis and characterization of nanoscale silver paste for device attachment and packaging substrate evaluation for high-temperature electronics applications. He has joined Ford Motor Co. in Dearborn, Michigan.

Thomas loves playing basketball and tennis in leisure time. He also enjoys music, movies, reading and cooking in pursuit of better life quality. 

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