New SBIR-STTR Supplemental Award enables research collaboration on High-Temperature Packaging
CPES has been pursuing technologies that would increase the operating temperature of its integrated power electronic modules (IPEM) beyond 250°C. Thanks to the National Science Foundation Engineering Research Centers (NSF ERC) Small Business Innovation Research/Small Business Technology Transfer (SBIR/STTR) Phase II supplemental funding opportunity for collaborative research, CPES has teamed with Advanced Thermal Technologies (ATT) to conduct research on "Thermally-Efficient, Mechanically-Reliable Packaging of High-Temperature Power Semiconductor".
IPEMs serve as building blocks for power electronic systems. Currently, overall thermal management is not an integrated part of the Center's low-temperature package, i.e., a die is attached to an aluminum heat sink via layers of copper, ceramic, solder, and thermal grease, as in Fig. 1 (a). These thermal layers constitute an inefficient heat conduit unsuitable for high-temperature applications. The mismatch among the coefficients of thermal expansion (CTE) of the layers leads to premature failure during temperature cycling. Thus, a thermally efficient, mechanically reliable high-temperature packaging paradigm is being sought that leverages state-of-the-art thermal management materials and packaging processes. In particular, CPES needs a CTE-matched, isolated, solderable heat sink (CMISHS) to which dice or solderable modules can be directly bonded, as shown in Fig. 1 (b), eliminating a majority of the thermal/packaging layers.
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ATT's SBIR is aimed at producing graphite-metal and dielectric-graphite-metal (DGM) materials with high thermal conductivity that are CTE matched to the semiconductor die -- the ingredients for CMISHS. CPES will share its capability in electro-thermo-mechanical design and its process for package integration with ATT. Together, the team will demonstrate the feasibility of a unique integrated electronics/thermal management package that is particularly suitable for high-temperature, but also beneficial for low-temperature power electronics. The particular mechanism for the exchange between ATT and CPES is a demonstration prototype showcasing both parties' technologies.
ATT will take advantage of the unique paradigm shift in manufacturing and marketing, connect with the Center's power electronic industry and government partners, and invite business partners to commercialize the technology for a variety of market applications. CPES will incorporate the results of the program into engineering courses in order to teach state-of-the-art materials and processes for thermal management and packaging to its graduate and undergraduate students.